Dual Interface Card Manufacturing Flexible Bump

Dual Interface Card Manufacturing Process using Flexible Bump technology


Card inlay construction during flexible bump manufacturing


Process Milling Construction Test

Flexible Bump Dispense

Module Implant

Milling for COB

Make contacts

Antenna Test

Flexible Bump Dispense

Curing 24 hours

Press with Heat
Required Tool & Equipment Milling Machine

Milling Machine

FBC1200 Implant Machines



Milling Chip module and flexible bump positions

Felixble Bump Glue Dispensing

flexible bump glue dispense

Chip module iCOB implant

Chip module embedding